ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,564, issued on Feb. 24, was assigned to ABB Schweiz AG (Baden, Switzerland). "Reducing inrush current to a capacitor bank" was invented by ... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,892, issued on Feb. 24. "Wakeup device utilizing weight of liquid to enable and disable functionality" was invented by Joshua Camden Volken... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,577, issued on Feb. 24, was assigned to TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA INC. (Plano, Texas) and TOYOTA JIDOSHA K.K. (... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,432, issued on Feb. 24, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea). "Substrate for separator of electrochemical device, s... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,558,408, issued on Feb. 24, was assigned to ImmunityBio Inc. (San Diego). "Intratumorally injected yeast vaccine" was invented by Thomas H. Kin... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,561,904, issued on Feb. 24, was assigned to Canon K.K. (Tokyo). "Image processing device and image processing method for correcting computer gr... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,267, issued on Feb. 24, was assigned to Wing Aviation LLC (Palo Alto, Calif.). "Offset drag reduction device" was invented by Aaron Bryce C... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,707, issued on Feb. 24, was assigned to DEKA LP (Manchester, N.H.). "Modular, configurable bioreactor system for a manufacturing line" was ... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,167, issued on Feb. 24, was assigned to QUALCOMM Inc. (San Diego). "Companion device assisted multi-view video coding" was invented by Yeho... Read More
ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,027, issued on Feb. 24, was assigned to Tokyo Electron Ltd. (Tokyo). "Top-down self-alignment of vias in a semiconductor device for sub-22N... Read More